once one can make traces in 3D as part of a case/shell/frame/structure things get _very_ interesting --- consider that one electronics designer actually worked up a 3D CAD system:
>My primary use case for 3D CAD is designing 3D-printed enclosures for my electronics projects.
So, imagine what folks like that will make when they are able to 3D print a full circuit board as part of a structure, with components place/oriented in it in novel ways (heat dissipation? LEDs to indicate status?)....
Though, I generally like the idea of circuit traces embedded directly in mechanical design of a product, I suppose this would make devices completely and utterly non-repairable. Not that there's something new in this, but imagine, debugging a 3d volumetric circuit, where chips and discrete components baked solid into medium? And I also wonder, where such super high level of integration would be necessary, other than medical/wearable/implantable devices...
The article reads like they are talking about the traces. What about components like surface mount resistors, IC's, etc?
The examples I noticed were things like antennas, grids, a microspring. I didn't see anything resembling a full circuit.
Components are pretty easily done via pick-and-place, which was just demonstrated on video:
https://www.youtube.com/watch?v=MGZ0qpPN1uk
once one can make traces in 3D as part of a case/shell/frame/structure things get _very_ interesting --- consider that one electronics designer actually worked up a 3D CAD system:
https://dune3d.org/
just for making 3D printed enclosures:
>My primary use case for 3D CAD is designing 3D-printed enclosures for my electronics projects.
So, imagine what folks like that will make when they are able to 3D print a full circuit board as part of a structure, with components place/oriented in it in novel ways (heat dissipation? LEDs to indicate status?)....
Though, I generally like the idea of circuit traces embedded directly in mechanical design of a product, I suppose this would make devices completely and utterly non-repairable. Not that there's something new in this, but imagine, debugging a 3d volumetric circuit, where chips and discrete components baked solid into medium? And I also wonder, where such super high level of integration would be necessary, other than medical/wearable/implantable devices...
They are produced by companies that specialise in producing ICs.
They can be placed manually or automated.